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Moisture Sensitivity of Plastic Packages of IC Devices

Produktform: E-Buch Text Elektronisches Buch in proprietärem


This book provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. It includes numerous industrial applications, along with the results of the most recent research and development efforts.

Verlag: Springer US, 558 Seiten

Elektronisches Format: PDF

Erscheinungsdatum: 23.07.2010

255,73 € inkl. MwSt.
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Moisture Sensitivity of Plastic Packages of IC Devices

Produktform: Buch / Einband - flex.(Paperback)


This book provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. It includes numerous industrial applications, along with the results of the most recent research and development efforts.

Verlag: Springer US, Auflage 1, 558 Seiten

Erscheinungsdatum: 05.09.2012

267,49 € inkl. MwSt.
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lieferbar - Lieferzeit 10-15 Werktage

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Moisture Sensitivity of Plastic Packages of IC Devices

Produktform: Buch / Einband - fest (Hardcover)


This book provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. It includes numerous industrial applications, along with the results of the most recent research and development efforts.

Verlag: Springer US, Auflage 1, 558 Seiten

Erscheinungsdatum: 19.07.2010

267,49 € inkl. MwSt.
kostenloser Versand

lieferbar - Lieferzeit 10-15 Werktage

zum Artikel