Solder Joint Reliability Assessment
Finite Element Simulation Methodology
Produktform: E-Buch Text Elektronisches Buch in proprietärem
This book offers a systematic approach to assessing reliability of solder joints using Finite Element simulation, including problems in solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, mechanisms of joint fatigue and more.
96,29 € inkl. MwSt.
Recommended Retail Price
kostenloser Versand
lieferbar - Lieferzeit 10-15 Werktage
Solder Joint Reliability Assessment
Finite Element Simulation Methodology
Produktform: Buch / Einband - fest (Hardcover)
This book offers a systematic approach to assessing reliability of solder joints using Finite Element simulation, including problems in solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, mechanisms of joint fatigue and more.
106,99 € inkl. MwSt.
kostenloser Versand
lieferbar - Lieferzeit 10-15 Werktage
Solder Joint Reliability Assessment
Finite Element Simulation Methodology
Produktform: Buch / Einband - flex.(Paperback)
This book offers a systematic approach to assessing reliability of solder joints using Finite Element simulation, including problems in solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, mechanisms of joint fatigue and more.
106,99 € inkl. MwSt.
kostenloser Versand
lieferbar - Lieferzeit 10-15 Werktage