Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering
Wafer-level Transfer Packaging and Fabrication Techniques using Interface Energy Control Method
Produktform: E-Buch Text Elektronisches Buch in proprietärem
139,09 € inkl. MwSt.
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Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering
Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Produktform: Buch / Einband - flex.(Paperback)
149,79 € inkl. MwSt.
kostenloser Versand
lieferbar - Lieferzeit 10-15 Werktage
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering
Wafer-level Transfer Packaging and Fabrication Techniques using Interface Energy Control Method
Produktform: Buch / Einband - fest (Hardcover)
149,79 € inkl. MwSt.
kostenloser Versand
lieferbar - Lieferzeit 10-15 Werktage