Power Electronic Packaging

Design, Assembly Process, Reliability and Modeling

Produktform: E-Buch Text Elektronisches Buch in proprietärem

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3D Cinematic Aesthetics and Storytelling

Produktform: E-Buch Text Elektronisches Buch in proprietärem

Power Electronic Packaging

Design, Assembly Process, Reliability and Modeling

Produktform: Buch / Einband - flex.(Paperback)

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3D Cinematic Aesthetics and Storytelling

Produktform: Buch / Einband - flex.(Paperback)

Power Electronic Packaging

Design, Assembly Process, Reliability and Modeling

Produktform: Buch / Einband - fest (Hardcover)

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3D Cinematic Aesthetics and Storytelling

Produktform: Buch / Einband - fest (Hardcover)

Stochastic Network Calculus

Produktform: E-Buch Text Elektronisches Buch in proprietärem

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Wafer-Level Chip-Scale Packaging

Analog and Power Semiconductor Applications

Produktform: E-Buch Text Elektronisches Buch in proprietärem

Passive and Active Measurement

16th International Conference, PAM 2015, New York, NY, USA, March 19-20, 2015, Proceedings

Produktform: E-Buch Text Elektronisches Buch in proprietärem

Intelligence Computation and Applications

14th International Symposium, ISICA 2023, Guangzhou, China, November 18–19, 2023, Revised Selected Papers, Part II

Produktform: E-Buch Text Elektronisches Buch in proprietärem