Noch Fragen? 0800 / 33 82 637

3D Microelectronic Packaging

From Fundamentals to Applications

Produktform: E-Buch Text Elektronisches Buch in proprietärem

This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development. weiterlesen

Dieser Artikel gehört zu den folgenden Serien

Elektronisches Format: PDF

Sprache(n): Englisch

ISBN: 978-3-319-44586-1 / 978-3319445861 / 9783319445861

Verlag: Springer International Publishing

Erscheinungsdatum: 20.01.2017

Seiten: 463

Herausgegeben von Yan Li, Deepak Goyal

181,89 € inkl. MwSt.
Recommended Retail Price
kostenloser Versand

lieferbar - Lieferzeit 10-15 Werktage

zurück