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Advanced Wirebond Interconnection Technology

Produktform: E-Buch Text Elektronisches Buch in proprietärem

addresses wire bonding from both manufacturing and reliability perspectives. It analyzes and explores the various factors that one needs to consider: design, materials, processing, equipment, quality testing and reliability engineering, and last but not the least, operator training. This book is intended to be a comprehensive source of information and knowledge that enables both a newcomer to the field and a veteran who needs instant information to make a decision on a process problem. The book explains not only how to do things such as: designing a bond pad or a lead finger, how to select a right bond wire, how to design a capillary and how to optimize a bonding process on the factory floor; but the book also explains why to do it that way.weiterlesen

Elektronisches Format: PDF

Sprache(n): Englisch

ISBN: 978-1-4020-7763-0 / 978-1402077630 / 9781402077630

Verlag: Springer US

Erscheinungsdatum: 10.05.2006

Seiten: 669

Autor(en): Shankara K. Prasad

309,23 € inkl. MwSt.
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