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Electrothermal Analysis of VLSI Systems

Produktform: Buch / Einband - fest (Hardcover)

addresses electrothermal problems in modern VLSI systems. Part I, The Building Blocks, discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires (including power analysis, temperature-dependent device modeling, thermal/electrothermal simulation, and experimental setup-calibration). Part II, The Applications, discusses three important applications of VLSI electrothermal analysis including temperature-dependent electromigration diagnosis, cell-level thermal placement and temperature-driven power and timing analysis. will be useful for researchers in the fields of IC reliability analysis and physical design, as well as VLSI designers and graduate students. weiterlesen

Sprache(n): Englisch

ISBN: 978-0-7923-7861-7 / 978-0792378617 / 9780792378617

Verlag: Springer US

Erscheinungsdatum: 30.06.2000

Seiten: 210

Auflage: 1

Autor(en): Sung-Mo (Steve) Kang, Yi-Kan Cheng, Ching-Han Tsai, Chin-Chi Teng

106,99 € inkl. MwSt.
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lieferbar - Lieferzeit 10-15 Werktage

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