Chapter 5 covers static deformation, including hardness and brittle behavior, while Chapter 6 explains the phenomenon of work hardening and its relationship to dislocations in the material. Chapter 7 introduces time-dependent deformation, specifically creep, which is influenced by temperature. Fracture, a common mode of failure in semiconductors, is discussed in Chapter 8, with an emphasis on stress rupture and the inability to carry an applied load. Chapter 9 addresses the unique mechanical behavior of small size semiconductor specimens in the nano scale. Finally, Chapter 10 explores the environmental effects on the mechanical properties of semiconductors. weiterlesen