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ETG-Fb. 173: CIPS 2024

13th International Conference on Integrated Power Electronics Systems, March, 12 – 14, 2024, Düsseldorf, Germany

Produktform: CD-ROM

In the next decades, power electronic system development will be driven by energy saving systems, intelligent energy management, power quality, system miniaturization and high reliability. Monolithic and hybrid system integration will include advanced device concepts including wide bandgap devices, new packaging technologies and the overall integration of actuators/drives (mechatronic integration). CIPS is consequently focused on the following main aspects: - assembly and interconnect technology for power electronic devices and converters - integration of hybrid systems and mechatronic systems with high power density - systems´ and components‘ operational behaviour and reliabilityweiterlesen

Dieser Artikel gehört zu den folgenden Serien

Sprache(n): Englisch

ISBN: 978-3-8007-6288-0 / 978-3800762880 / 9783800762880

Verlag: VDE VERLAG

Erscheinungsdatum: 17.06.2024

Seiten: 730

Auflage: 1

Herausgegeben von VDE ETG

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