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Failure Analysis of Integrated Circuits

Tools and Techniques

Produktform: Buch / Einband - fest (Hardcover)

provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. These include applications specific to performing failure analysis such as decapsulation, deprocessing, and fail site isolation, as well as physical and chemical analysis tools and techniques. The coverage is qualitative, and it provides a general understanding for making intelligent tool choices. Also included is coverage of the shortcomings, limitations, and strengths of each technique. is a `must have' reference work for semiconductor professionals and researchers. weiterlesen

Dieser Artikel gehört zu den folgenden Serien

Sprache(n): Englisch

ISBN: 978-0-412-14561-2 / 978-0412145612 / 9780412145612

Verlag: Springer US

Erscheinungsdatum: 31.01.1999

Seiten: 255

Auflage: 1

Zielgruppe: Research

Herausgegeben von Lawrence C. Wagner

160,49 € inkl. MwSt.
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