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Handbook of 3D Integration

Vol. 4: Design, Test, and Thermal Management

Produktform: E-Buch Text Elektronisches Buch in proprietärem

This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration. weiterlesen

Elektronisches Format: PDF

Sprache(n): Englisch

ISBN: 978-3-527-69704-5 / 978-3527697045 / 9783527697045

Verlag: Wiley-VCH

Erscheinungsdatum: 25.01.2019

Seiten: 488

Auflage: 1

Reihe herausgegeben von Peter Ramm, Philip Garrou, Mitsumasa Koyanagi
Herausgegeben von Paul D. Franzon, Muhannad S. Bakir, Erik Jan Marinissen

151,99 € inkl. MwSt.
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