Noch Fragen? 0800 / 33 82 637

High Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Method

Produktform: Buch / Einband - flex.(Paperback)

In the last two decades, the reliability of small electronic devices used in automotive or consumer electronics gained researchers attention. Thus, there is the need to understand the fatigue properties and damage mechanisms of thin films. In this thesis a novel high-throughput testing method for thin films on Si substrate is presented. The specialty of this method is to test one sample at different strain amplitudes at the same time and measure an entire lifetime curve with only one experiment.weiterlesen

Sprache(n): Englisch

ISBN: 978-3-7315-0025-4 / 978-3731500254 / 9783731500254

Verlag: KIT Scientific Publishing

Erscheinungsdatum: 02.07.2013

Seiten: 169

Autor(en): Sofie Burger

41,00 € inkl. MwSt.
kostenloser Versand

lieferbar - Lieferzeit 10-15 Werktage

zurück