Noch Fragen? 0800 / 33 82 637

Mechanics of Solder Alloy Interconnects

Produktform: Buch / Einband - fest (Hardcover)

The is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer. weiterlesen

Sprache(n): Englisch

ISBN: 978-0-442-01505-3 / 978-0442015053 / 9780442015053

Verlag: Springer US

Erscheinungsdatum: 31.01.1994

Seiten: 418

Auflage: 1

Zielgruppe: Research

Autor(en): John H. Lau, Darrel R. Frear, Steven N. Burchett, Harold S. Morgan

213,99 € inkl. MwSt.
kostenloser Versand

lieferbar - Lieferzeit 10-15 Werktage

zurück