Mechanics of Solder Alloy Interconnects
Produktform: Buch / Einband - fest (Hardcover)
The is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer. weiterlesen
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