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Metal-Dielectric Interfaces in Gigascale Electronics

Thermal and Electrical Stability

Produktform: Buch / Einband - flex.(Paperback)

 provides a unifying approach to the diverse and sometimes contradictory test results that are reported in the literature on metal-dielectric interfaces. The goal is to provide readers with a clear account of the relationship between interface science and its applications in interconnect structures. The material presented here will also be of interest to those engaged in field-effect transistor and memristor device research, as well as university researchers and industrial scientists working in the areas of electronic materials processing, semiconductor manufacturing, memory chips, and IC design.weiterlesen

Dieser Artikel gehört zu den folgenden Serien

Sprache(n): Englisch

ISBN: 978-1-4939-4308-1 / 978-1493943081 / 9781493943081

Verlag: Springer US

Erscheinungsdatum: 23.08.2016

Seiten: 149

Auflage: 1

Autor(en): Ming He, Toh-Ming Lu

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