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Microelectronics Packaging Handbook on CD-ROM

Produktform: CD-ROM

The continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing processes. Now available on CD-ROM for the first time, it discusses state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. The CD-ROM version includes a navigational scheme for easy access to content, hypertext links for glossary terms, references, footnotes and graphics, and full text search capabilities for more powerful querying of the information. weiterlesen

Sprache(n): Englisch

ISBN: 978-0-412-08561-1 / 978-0412085611 / 9780412085611

Verlag: Springer US

Erscheinungsdatum: 31.03.1998

Seiten: 1000

Auflage: 2

Zielgruppe: Research

Autor(en): Alan G. Klopfenstein, Eugene J. Rymaszewski, Rao Tummala, R.R. Tummala

367,71 € inkl. MwSt.
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