New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation
Produktform: E-Buch Text Elektronisches Buch in proprietärem
In order to sustain Moore's Law-based device scaling, principal attention has focused on toward device architectural innovations for improved device performance as per ITRS projections for technology nodes up to 10 nm. Efficient integration of lower substrate temperatures (weiterlesen
Dieser Artikel gehört zu den folgenden Serien
28,88 € inkl. MwSt.
Recommended Retail Price
kostenloser Versand
lieferbar - Lieferzeit 10-15 Werktage
zurück