The aim of this work is to investigate the reliability of microelectronic assemblies encapsulated by thermoset injection molding. One part of this work was to build up an improved understanding of the process simulation. Research was conducted in order to build up a knowledge base of the material parameters required for injection molding simulations of thermosets as well as their underlying measurement methods. In addition, the effect of simulation parameters on the error of predicting filling behavior was studied. The goal was to develop an understanding of which simulation parameters are particularly relevant and which model simplifications can be made since this is directly related to the measurement effort of material data and computing time. A further question is which minimum wall thickness (weiterlesen