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The Electronics Assembly Handbook

Produktform: Buch / Einband - flex.(Paperback)

The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in "Assembly Engineering" and "Electronic Packaging and Production", will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation.weiterlesen

Sprache(n): Englisch

ISBN: 978-3-662-13163-3 / 978-3662131633 / 9783662131633

Verlag: Springer Berlin

Erscheinungsdatum: 03.10.2013

Seiten: 603

Auflage: 1

Herausgegeben von Frank Riley, Electronic Packaging and Production

192,59 € inkl. MwSt.
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lieferbar - Lieferzeit 10-15 Werktage

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