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The Electronics Assembly Handbook

Produktform: E-Buch Text Elektronisches Buch in proprietärem

The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in "Assembly Engineering" and "Electronic Packaging and Production", will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation.weiterlesen

Elektronisches Format: PDF

Sprache(n): Englisch

ISBN: 978-3-662-13161-9 / 978-3662131619 / 9783662131619

Verlag: Springer Berlin

Erscheinungsdatum: 29.06.2013

Seiten: 603

Herausgegeben von Frank Riley, Electronic Packaging and Production

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