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Thermal Onboard Detection of Power Semiconductor Interconnection Faults

Produktform: Buch / Einband - flex.(Paperback)

Condition monitoring of power electronics increases the safety and reliability of autonomous driving and electrical vehicles. Therefore, this thesis presents a concept for the detection of assembly and interconnection faults in power semiconductors during operation. Based on simulation and measurement results of a test arrangement, three detection algorithms using the readings of external temperature sensors are presented. Experimental results show that common degradation mechanisms are reliably detected and fault growth can be observed. Furthermore, two machine-learning classification approaches are presented to complement the detection algorithms.weiterlesen

Dieser Artikel gehört zu den folgenden Serien

Sprache(n): Englisch

ISBN: 978-3-8440-9619-4 / 978-3844096194 / 9783844096194

Verlag: Shaker

Erscheinungsdatum: 30.08.2024

Seiten: 159

Auflage: 1

Autor(en): Nils Jahn

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